G.N. Gaydadjiev, TU Delft, NL
J. Glossner, Sandbridge Technologies, US

H. Blume, RWTH Aachen, DE
P. Knijnenburg, University of Amsterdam, NL

H. Blume, RWTH Aachen, DE
C. Galuzzi, TU Delft, NL

S. Wong, TU Delft, NL

S. Bhattacharyya, University of Maryland, US
J. Glossner, Sandbridge Technologies, US
A.D. Pimentel, University of Amsterdam, NL
J. Takala, Tampere University of Technology, FI
S. Vassiliadis, TU Delft, NL (chairperson)

N. Dimopoulos, Victoria University, CA
W. Luk, Imperial College, GB
O. Silvén, University of Oulu, FI
J. Teich, University of Erlangen-Nuremberg, DE

L. Benini, University of Bologna, IT
S. Bhattacharyya, University of Maryland, US
M. Botteck, Nokia, DE
J. M. P. Cardoso, INESC-ID/IST, PT
L. Carro, UFRGS, BR
J. Choi, LG, KR
T. Conte, North Carolina State University, US
J. G. Delgado-Frias, Washington State University, US
P. Diniz, University of Southern California, US
N. Dutt, University of California Irvine, US
M. Glesner, TU Darmstadt, DE
S. Ha, Seoul National University, KR
J. Henkel, University of Karlsruhe, DE
A. Herkersdorf, TU München, DE
R. Hermida, Complutense University of Madrid, ES
S. Hong, Seoul National University, KR
L. Jozwiak, TU Eindhoven, NL
S. Kaxiras, University of Patras, GR
F. J. Kurdahi, University of California Irvine, US
M. Kuulusa, Nokia, FI
J. Madsen, Technical University of Denmark, DK
R. Merker, TU Dresden, DE
W. Najjar, University of California Riverside, US
S. Patel, University of Illinois at Urbana-Champaign, US
A. D. Pimentel, University of Amsterdam, NL
D. N. Pnevmatikatos, Technical University of Crete, GR
L. Pozzi, University of Lugano, CH
M. Schulte, University of Wisconsin-Madison, US
D. Sciuto, Politecnico di Milano, IT
E. Sha, University of Texas at Dallas, US
C. Silvano, Politecnico di Milano, IT
D. Soudris, Democritus University of Thrace, GR
D. Stroobandt, Ghent University, BE
W. Sung, Seoul National University, KR
J. Takala, Tampere University of Technology, FI
S. Vassiliadis, TU Delft, NL
J.-P. Wittenburg, Thomson Corporate Research, DE
S. Yehia, ARM, GB
S. Yun, Yonsei University, KR
S. Ziavras, New Jersey Institute of Technology, US